High Yield Intra-Cavity Interconnection Fabrication Method And Characterization Methodologies
نویسندگان
چکیده
Northrop Grumman Space Technology has demonstrated the capability to manufacture intra-cavity interconnections (ICICs), which consistently yield greater than 99%. These ICICs are an integral part of MMICs packaged at the wafer level using wafer bonding techniques. Efficient test structures were designed to evaluate these interconnects, allowing fast on-wafer assessment of interconnect yield in a production environment.
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تاریخ انتشار 2007